- Patent Title: Structure and formation method of semiconductor device structure
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Application No.: US14856875Application Date: 2015-09-17
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Publication No.: US09779959B2Publication Date: 2017-10-03
- Inventor: Jean-Pierre Colinge , Carlos H. Diaz
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/308 ; H01L29/78 ; H01L29/66 ; H01L29/423 ; H01L21/311 ; H01L21/31

Abstract:
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a fin structure over a semiconductor substrate. The semiconductor device structure also includes a gate stack covering a portion of the fin structure. The semiconductor device structure further includes a spacer element over a sidewall of the gate stack. The spacer element includes a first layer and a second layer over the first layer. The dielectric constant of the first layer is greater than the dielectric constant of the second layer.
Public/Granted literature
- US20170084461A1 STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE Public/Granted day:2017-03-23
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