Invention Grant
- Patent Title: Method of inspecting a surface of a substrate and apparatus for performing the same
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Application No.: US14460814Application Date: 2014-08-15
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Publication No.: US09772296B2Publication Date: 2017-09-26
- Inventor: Byung-Bok Kang , Seok-Min Kang , Bon-Ok Koo , Kyoung-Hwan Kim , Myung-Woo Kim , In-Gi Kim , Hyun-Chul Kim , Sung-Ki Roh , Gyung-Jin Min , Eun-Seok Lee , Jin-Suk Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0130794 20131031
- Main IPC: G01N21/95
- IPC: G01N21/95 ; G01N21/88

Abstract:
In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.
Public/Granted literature
- US20150116698A1 METHOD OF INSPECTING A SURFACE OF A SUBSTRATE AND APPARATUS FOR PERFORMING THE SAME Public/Granted day:2015-04-30
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