A facility for depositing a film of ordered particles onto a moving substrate, the facility configured to allow deposition, onto the substrate, of a film of ordered particles escaping from a particle outlet of a transfer zone having a first width. The facility further includes an accessory device in a form of a deposit head, provided to seal the particle outlet and configured to allow the deposition, onto the substrate, of a film of ordered particles escaping from an end of a particle transfer channel of the deposit head, the end having a second width strictly lower than the first width.