- 专利标题: Semiconductor structure having a gas-filled gap
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申请号: US15051619申请日: 2016-02-23
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公开(公告)号: US09716154B2公开(公告)日: 2017-07-25
- 发明人: Che-Cheng Chang , Chih-Han Lin , Horng-Huei Tseng
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Maschoff Brennan
- 主分类号: H01L29/41
- IPC分类号: H01L29/41 ; H01L29/40 ; H01L29/417 ; H01L21/311
摘要:
A semiconductor structure includes a substrate, at least one first gate structure, at least one source drain structure, at least one bottom conductor, and a first dielectric layer. The first gate structure is present on the substrate. The source drain structure is present on the substrate. The bottom conductor is electrically connected to the source drain structure. The bottom conductor has an upper portion and a lower portion between the upper portion and the source drain structure, and a gap is at least present between the upper portion of the bottom conductor and the first gate structure. The first dielectric layer is at least present between the lower portion of the bottom conductor and the first gate structure.
公开/授权文献
- US20170179242A1 SEMICONDUCTOR STRUCTURE HAVING A GAS-FILLED GAP 公开/授权日:2017-06-22
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