- 专利标题: Method of preventing epitaxy creeping under the spacer
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申请号: US15130680申请日: 2016-04-15
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公开(公告)号: US09704993B2公开(公告)日: 2017-07-11
- 发明人: Veeraraghavan S. Basker , Kangguo Cheng , Ali Khakifirooz , Sreenivasan Raghavasimhan
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 代理机构: Scully, Scott, Murphy & Presser, P.C.
- 代理商 Steven J. Meyers
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/78 ; H01L29/66 ; H01L21/8234 ; H01L29/08 ; H01L29/16 ; H01L29/161 ; H01L29/165
摘要:
After forming a gate spacer on each sidewall of a sacrificial gate structure, portions of each dielectric fin cap portion underneath the gate spacer is intentionally etched and undercut regions that are formed are filled and pinched off with a dielectric material of a conformal dielectric liner. Portions of the conformal dielectric liner in the undercut regions are not subject to the undercut during an epitaxial pre-clean process performed prior to forming an epitaxial source region and an epitaxial drain region on opposite sides of the sacrificial gate structure and remain in the undercut regions after forming the epitaxial source region and the epitaxial drain region.
公开/授权文献
- US20160233337A1 METHOD OF PREVENTING EPITAXY CREEPING UNDER THE SPACER 公开/授权日:2016-08-11
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