Invention Grant
- Patent Title: Semiconductor packages including flexible wing interconnection substrate
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Application No.: US15013553Application Date: 2016-02-02
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Publication No.: US09659909B2Publication Date: 2017-05-23
- Inventor: Hee Min Shin , Mi Young Kim
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-Si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-Si
- Agency: William Park & Associates Ltd.
- Priority: KR10-2015-0132792 20150921
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/495 ; H01L51/00 ; H01L41/047 ; H01L23/538 ; H01L23/00 ; H01L25/065 ; H01L23/48 ; H01L23/31
Abstract:
A semiconductor package includes a first semiconductor package, a second semiconductor package disposed on the first semiconductor package, and a flexible wing interconnection substrate disposed between the first and second semiconductor packages.
Public/Granted literature
- US20170084579A1 SEMICONDUCTOR PACKAGES INCLUDING FLEXIBLE WING INTERCONNECTION SUBSTRATE Public/Granted day:2017-03-23
Information query
IPC分类:
