发明授权
- 专利标题： Methods and apparatus for measuring a property of a substrate
- 专利标题（中）： 用于测量基材性质的方法和装置
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申请号： US14355962申请日： 2012-11-22
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公开(公告)号： US09594029B2公开(公告)日： 2017-03-14
- 发明人: Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Li Chung-Hsun
- 申请人： ASML Netherlands B.V.
- 申请人地址： NL Veldhoven
- 专利权人： ASML Netherlands B.V.
- 当前专利权人： ASML Netherlands B.V.
- 当前专利权人地址： NL Veldhoven
- 代理机构： Sterne, Kessler, Goldstein & Fox P.L.L.C.
- 国际申请： PCT/EP2012/073396 WO 20121122
- 国际公布： WO2013/092106 WO 20130627
- 主分类号： G01N21/95
- IPC分类号： G01N21/95 ; G01B11/02 ; G01B11/14 ; G05B19/418 ; G03F7/20 ; G01N21/956 ; H01L21/66
摘要：
In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced (2506) defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used (2508) to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked (2510) to at least partially recompose the measurement results according to the sample plan.
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