Invention Grant
- Patent Title: Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages
- Patent Title (中): 晶圆片上基板封装上的晶片过程控制监控
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Application No.: US13905958Application Date: 2013-05-30
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Publication No.: US09581638B2Publication Date: 2017-02-28
- Inventor: Wei-Cheng Wu , Li-Han Hsu , Sao-Ling Chiu , Shang-Yun Hou , Shin-Puu Jeng , Chen-Hua Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/28
Abstract:
An embodiment method includes providing a standardized testing structure design for a chip-on-wafer (CoW) structure, wherein the standardized testing structure design comprises placing a testing structure in a pre-selected area a top die in the CoW structure, and electrically testing a plurality of microbumps in the CoW structure by applying a universal testing probe card to the testing structure.
Public/Granted literature
- US20140266283A1 Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages Public/Granted day:2014-09-18
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