发明授权
- 专利标题： Leadframe package with pre-applied filler material
- 专利标题（中）： 引线框封装，预填充材料
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申请号： US14579902申请日： 2014-12-22
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公开(公告)号： US09578744B2公开(公告)日： 2017-02-21
- 发明人: Jefferson Talledo , Frederick Ray Gomez
- 申请人： STMicroelectronics, Inc.
- 申请人地址： PH Calamba
- 专利权人： STMicroelectronics, Inc.
- 当前专利权人： STMicroelectronics, Inc.
- 当前专利权人地址： PH Calamba
- 代理机构： Seed IP Law Group LLP
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/02 ; H01L23/48 ; H01L23/52 ; H05K1/11 ; H01L23/00 ; H05K1/18 ; H01L23/31 ; H01L21/56
摘要：
Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.
公开/授权文献
- US20160183369A1 LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL 公开/授权日：2016-06-23
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