发明授权
- 专利标题: IC-package interconnect for millimeter wave systems
- 专利标题(中): 用于毫米波系统的IC封装互连
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申请号: US14582830申请日: 2014-12-24
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公开(公告)号: US09576915B2公开(公告)日: 2017-02-21
- 发明人: Mingda Huang , Markus Carolus Antonius van Schie
- 申请人: NXP B.V.
- 申请人地址: NL Eindhoven
- 专利权人: NXP B.V.
- 当前专利权人: NXP B.V.
- 当前专利权人地址: NL Eindhoven
- 主分类号: H01L23/50
- IPC分类号: H01L23/50 ; H01L23/66 ; H01L23/64 ; G06F17/50 ; H01L23/522 ; H01L49/02 ; H01P5/02

摘要:
Consistent with an example embodiment, a System on Chip (SoC) device operates in millimeter wave frequencies. The SoC device comprises, a silicon device having at least one differential pair pad, the at least one differential pair pad having a shunt inductor coupled thereon. A parasitic capacitance on at least one differential pair pads is tuned out by resonance of the shunt inductor. A package has a redistribution layer (RDL), with an array of contact areas to which the silicon device is mounted and then encapsulated. A connection corresponds to the at least one differential pair pad and the connection is located about an outer row or column of the array of contact areas.
公开/授权文献
- US20160190673A1 IC-PACKAGE INTERCONNECT FOR MILLIMETER WAVE SYSTEMS 公开/授权日:2016-06-30
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