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发明授权
US09572265B2 Method of producing an electronic circuit with protection of the conductive layer 有权
制造具有导电层保护的电子电路的方法

Method of producing an electronic circuit with protection of the conductive layer
摘要：
The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution.
摘要（中）：

本发明涉及一种制造电路的方法，包括该步骤包括将空腔的底壁连接到具有或不具有中间有线链路的电子部件，所述方法包括在蚀刻步骤之前的步骤，该步骤包括： 在空腔底部的导电层上的保护材料层，所述材料是能够硬化并且一旦硬化的耐蚀刻溶液的液体材料。

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