Invention Grant
- Patent Title: Semiconductor device and method of forming the same
- Patent Title (中): 半导体器件及其形成方法
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Application No.: US15046458Application Date: 2016-02-18
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Publication No.: US09524967B1Publication Date: 2016-12-20
- Inventor: Hao-Yeh Liu , Chien-Ming Lai , Yu-Ping Wang , Mon-Sen Lin , Ya-Huei Tsai , Ching-Hsiang Chiu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW105100737A 20160112
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L27/092 ; H01L21/8234

Abstract:
A semiconductor device and a method of forming the same, the semiconductor device include a substrate, and a first transistor, a second transistor and a third transistor all disposed on the substrate. The first transistor includes a first channel, and a first barrier layer and a first work function layer stacked with each other on the first channel. The second transistor includes a second channel, and a second barrier layer and a second work function layer stacked with each other. The third transistor includes a third channel and a third barrier layer and a third work function layer stacked with each other on the third channel, wherein the first barrier layer, the second barrier layer and the third barrier layer have different nitrogen ratio. The first, the second and the third transistors have different threshold voltages, respectively.
Information query
IPC分类: