Invention Grant
- Patent Title: Copper-and-titanium-containing composition and production method therefor
- Patent Title (中): 含铜和钛的组合物及其制备方法
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Application No.: US14000507Application Date: 2012-12-17
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Publication No.: US09516881B2Publication Date: 2016-12-13
- Inventor: So Miyaishi , Yasushi Kuroda , Yasuhiro Hosogi , Ding Li
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-281896 20111222; JP2012-121345 20120528; JP2012-175788 20120808
- International Application: PCT/JP2012/082706 WO 20121217
- International Announcement: WO2013/094572 WO 20130627
- Main IPC: A01N59/16
- IPC: A01N59/16 ; B01J27/122 ; A01N59/20 ; B01J21/06 ; B01J23/72 ; B01J37/03 ; B01J35/00 ; A01N55/02 ; A61L9/01 ; B01J27/055 ; B01J27/135 ; B01J27/25 ; B01J31/38
Abstract:
The Cu- and Ti-containing composition of the present invention contains titanium oxide having a rutile-type titanium oxide content of 15 mol % or more, and at least one divalent copper compound represented by the following formula (1). The Cu- and Ti-containing composition production method of the present invention is characterized by including stirring a mixture containing titanium oxide having a rutile-type titanium oxide content of 15 mol % or more, a divalent copper compound raw material represented by formula (2), water, and an alkaline compound, to thereby cause precipitation. The composition of the present invention exhibits excellent anti-viral property under light and in the dark, and excellent organic compound decomposition activity under light.
Public/Granted literature
- US20140322353A1 COPPER-AND-TITANIUM-CONTAINING COMPOSITION AND PRODUCTION METHOD THEREFOR Public/Granted day:2014-10-30
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