Invention Grant
- Patent Title: Hard magnetic exchange-coupled composite structures and perpendicular magnetic recording media including the same
- Patent Title (中): 硬磁交换耦合复合结构和包括其的垂直磁记录介质
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Application No.: US14150317Application Date: 2014-01-08
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Publication No.: US09495990B2Publication Date: 2016-11-15
- Inventor: Young-min Kang , Kyung-han Ahn , Sang-mock Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce P.L.C.
- Priority: KR10-2013-0085693 20130719
- Main IPC: G11B5/66
- IPC: G11B5/66 ; G11B5/667 ; G11B5/65 ; G11B5/73 ; H01F10/32
Abstract:
Hard magnetic exchange-coupled composite structures and perpendicular magnetic recording media including the hard magnetic exchange-coupled composite structures, include a ferrite crystal grain and a soft magnetic metal thin film bounded to the ferrite crystal grain by interfacial bonding on an atomic scale and having a thickness of about 5 nm or less, wherein a region of the soft magnetic metal thin film adjacent to an interface with the ferrite crystal grain includes an amorphous soft magnetic metal film.
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