发明授权
- 专利标题： Wafer support device
- 专利标题（中）： 晶圆支撑装置
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申请号： US13593479申请日： 2012-08-23
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公开(公告)号： US09472444B2公开(公告)日： 2016-10-18
- 发明人: Tien-Chih Cheng , Ying Zhang , Shu-Huei Suen , Chen-Chiao Kao
- 申请人： Tien-Chih Cheng , Ying Zhang , Shu-Huei Suen , Chen-Chiao Kao
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： McDermott Will & Emery LLP
- 主分类号： B05C13/00
- IPC分类号： B05C13/00 ; B23B31/28 ; B05D1/02 ; B05C11/00 ; B05D3/12 ; H01L21/687
摘要：
A wafer support device is provided. The wafer support device includes a plurality of support portions; and a bottom area located among the support portions, wherein the bottom area has a protective layer formed thereon. A method for processing a working surface of a wafer support device is also provided.
公开/授权文献
- US09355885B2 Wafer support device 公开/授权日：2016-05-31
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