Invention Grant
- Patent Title: Remote plasma source for controlling plasma skew
- Patent Title (中): 用于控制等离子体偏斜的远程等离子体源
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Application No.: US15068690Application Date: 2016-03-14
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Publication No.: US09466469B2Publication Date: 2016-10-11
- Inventor: Abdul Aziz Khaja , Mohamad A. Ayoub , Ramesh Bokka , Jay D. Pinson, II , Juan Carlos Rocha-Alvarez
- Applicant: Applied Materials, Inc.
- Applicant Address: US TX Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US TX Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
A plasma source is provided including a core element extending from a first end to a second end along a first axis. The plasma source further includes one or more coils disposed around respective one or more first portions of the core element. The plasma source further includes a plasma block having one or more interior walls at least partially enclosing an annular plasma-generating volume that is disposed around a second portion of the core element. The annular plasma-generating volume includes a first region that is symmetrical about a plurality of perpendicular axes that are perpendicular to a first point positioned on the first axis, the first region having a width in a direction parallel to the first axis and a depth in a direction perpendicular from the first axis. The first region has a width that is at least three times greater than the depth of the first region.
Public/Granted literature
- US20160268103A1 REMOTE PLASMA SOURCE FOR CONTROLLING PLASMA SKEW Public/Granted day:2016-09-15
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