Invention Grant
- Patent Title: Integrated antenna package
- Patent Title (中): 集成天线包
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Application No.: US12945825Application Date: 2010-11-12
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Publication No.: US09386688B2Publication Date: 2016-07-05
- Inventor: James MacDonald , William McKinzie, III , Walter Parmon , Lawrence Rubin
- Applicant: James MacDonald , William McKinzie, III , Walter Parmon , Lawrence Rubin
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01Q1/52
- IPC: H01Q1/52 ; H05K1/02 ; H01L23/552 ; H01L23/66 ; H01Q1/22 ; H01Q1/32 ; H01Q9/04 ; H01Q13/18 ; H01Q15/00 ; H01L23/00 ; H05K1/18

Abstract:
An integrated antenna package includes an interposer, an integrated circuit die, and a cap that forms a cavity within the integrated antenna package. A lossy ERG structure resides at the cap overlying the integrated circuit device. A lossless EBG structure resides at the cap overlying a microstrip feedline. A radar module includes a plurality of receive portions, each receive portion including a parabolic structure having a reflective surface, an absorber structure, a lens, and an antenna.
Public/Granted literature
- US20120119969A1 Integrated antenna package Public/Granted day:2012-05-17
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