Invention Grant
- Patent Title: Receiver front end architecture for intra band carrier aggregation
- Patent Title (中): 用于带内载波聚合的接收机前端架构
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Application No.: US14540900Application Date: 2014-11-13
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Publication No.: US09385901B2Publication Date: 2016-07-05
- Inventor: Gireesh Rajendran , Gurkanwal Singh Sahota , Rakesh Kumar
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Procopio, Cory, Hargreaves & Savitch, LLP
- Main IPC: H03F3/04
- IPC: H03F3/04 ; H04L27/26 ; H04L27/00 ; H04L5/00 ; H03F1/26 ; H03F1/22 ; H03F3/68 ; H03F3/72 ; H03F1/30 ; H03F1/32

Abstract:
A receiver front end architecture for intra band carrier aggregation is disclosed. In an exemplary embodiment, an apparatus includes a first transistor having a gate terminal to receive an input signal, drain terminal to output an amplified signal, and a source terminal connected to a signal ground by a source degeneration inductor. The apparatus also includes a second transistor having a source terminal connected to the drain terminal of the first transistor and a drain terminal connected to a first load. The apparatus also includes a third transistor having a gate terminal connected to the drain terminal of the first transistor, a drain terminal connected to a second load and a source terminal connected to a signal ground.
Public/Granted literature
- US20160142231A1 RECEIVER FRONT END ARCHITECTURE FOR INTRA BAND CARRIER AGGREGATION Public/Granted day:2016-05-19
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