发明授权
US09385134B2 Semiconductor device and method forming patterns with spaced pads in trim region
有权
半导体器件和方法在修剪区域中形成具有间隔垫的图案
- 专利标题： Semiconductor device and method forming patterns with spaced pads in trim region
- 专利标题（中）： 半导体器件和方法在修剪区域中形成具有间隔垫的图案
-
申请号： US14340710申请日： 2014-07-25
-
公开(公告)号： US09385134B2公开(公告)日： 2016-07-05
- 发明人: Jae-Ho Min , Ki-Jeong Kim , Kyoung-Sub Shin , Dong-Hyun Kim
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si, Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do
- 代理机构： Volentine & Whitt, PLLC
- 优先权： KR10-2011-0111411 20111028
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/48 ; H01L27/115 ; H01L27/02 ; H01L21/033 ; H01L21/3213 ; H01L27/32
摘要：
In a semiconductor device, parallel first and second conductive lines having a unit width extend from a memory cell region into a connection region. A trim region in the connection region includes pads respectively connected to the first and second conductive lines but are separated by a width much greater than the unit width.
公开/授权文献
信息查询
IPC分类:
