Invention Grant
- Patent Title: Circuit board
- Patent Title (中): 电路板
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Application No.: US14481188Application Date: 2014-09-09
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Publication No.: US09332642B2Publication Date: 2016-05-03
- Inventor: Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: PANASONIC CORPORATION
- Current Assignee: PANASONIC CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2009-251269 20091030; JP2009-251378 20091030; JP2009-253130 20091104; JP2009253501 20091104; JP2009253502 20091104
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; H05K3/10 ; H05K3/18 ; H05K3/40 ; H05K1/02 ; H05K1/03 ; H05K3/00
Abstract:
One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.
Public/Granted literature
- US20150034366A1 CIRCUIT BOARD Public/Granted day:2015-02-05
Information query
