Invention Grant
- Patent Title: Method of forming electric wiring using inkjet printing and inkjet printing apparatus
- Patent Title (中): 使用喷墨印刷和喷墨印刷设备形成电线的方法
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Application No.: US13890360Application Date: 2013-05-09
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Publication No.: US09295161B2Publication Date: 2016-03-22
- Inventor: Yong-wan Jin , Joong-hyuk Kim , Young-ki Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0133148 20121122
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K3/12
Abstract:
A method of forming an electric wiring includes forming a trench on a substrate and ejecting first ink and second ink into the trench. The second ink contains a conductive material. The method includes heating the substrate to sinter the second ink such that a tunnel is formed in a lower portion of the trench by evaporation of the first ink, and the conductive material forms the electric wiring in an upper portion of the trench.
Public/Granted literature
- US20140141155A1 METHOD OF FORMING ELECTRIC WIRING USING INKJET PRINTING AND INKJET PRINTING APPARATUS Public/Granted day:2014-05-22
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