发明授权
- 专利标题: Manufacturing method for transparent substrate
- 专利标题(中): 透明基板的制造方法
-
申请号: US13640444申请日: 2011-04-28
-
公开(公告)号: US09254627B2公开(公告)日: 2016-02-09
- 发明人: Daisuke Hattori , Takeshi Murashige , Tadayuki Kameyama
- 申请人: Daisuke Hattori , Takeshi Murashige , Tadayuki Kameyama
- 申请人地址: JP Ibaraki-shi
- 专利权人: NITTO DENKO CORPORATION
- 当前专利权人: NITTO DENKO CORPORATION
- 当前专利权人地址: JP Ibaraki-shi
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
- 优先权: JP2010-105140 20100430; JP2010-252704 20101111
- 国际申请: PCT/JP2011/060367 WO 20110428
- 国际公布: WO2011/136327 WO 20111103
- 主分类号: B44C1/17
- IPC分类号: B44C1/17 ; B32B17/06 ; B32B7/06 ; B32B17/10 ; B29C65/00 ; B32B38/00 ; G02F1/1333 ; B32B7/12 ; B29L9/00 ; B29L7/00 ; B29C65/48 ; B29L31/34 ; B32B37/00 ; B32B37/12 ; B32B38/10 ; B32B38/16
摘要:
There is provided a manufacturing method for a transparent substrate excellent in bending property, flexibility, impact resistance, and external appearance. A manufacturing method for a transparent substrate according to an embodiment of the present invention includes: a step A of applying a thermoplastic resin (A) composition solution onto a support backing having solvent permeability to form an applied layer; a step B of attaching at least one surface of an inorganic glass and the applied layer to each other via an adhesive composition to form a laminate; a step C of subjecting the laminate to a first heat treatment to reduce an amount of a solvent remaining in the applied layer to a predetermined amount; and a step D including peeling the support backing from the laminate and subjecting the resultant to a second heat treatment to dry the applied layer, thereby forming a thermoplastic resin layer.
公开/授权文献
- US20130032277A1 MANUFACTURING METHOD FOR TRANSPARENT SUBSTRATE 公开/授权日:2013-02-07
信息查询
IPC分类: