发明授权
US09252135B2 Packaged semiconductor devices and methods of packaging semiconductor devices
有权
封装的半导体器件和封装半导体器件的方法
- 专利标题： Packaged semiconductor devices and methods of packaging semiconductor devices
- 专利标题（中）： 封装的半导体器件和封装半导体器件的方法
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申请号： US14180208申请日： 2014-02-13
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公开(公告)号： US09252135B2公开(公告)日： 2016-02-02
- 发明人: Chen-Hua Yu , Chung-Shi Liu , Chih-Fan Huang , Chih-Wei Lin , Wei-Hung Lin , Ming-Da Cheng
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L25/10 ; H01L21/56 ; H01L23/31 ; H01L23/528 ; H01L21/768 ; H01L21/82 ; H01L23/04 ; H01L23/367 ; H01L23/00
摘要：
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a molding compound disposed around the integrated circuit die, and an interconnect structure disposed over the integrated circuit die and the molding compound. The molding compound is thicker than the integrated circuit die.
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