Invention Grant
- Patent Title: Chip inductor and method for manufacturing the same
- Patent Title (中): 片式电感及其制造方法
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Application No.: US13725478Application Date: 2012-12-21
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Publication No.: US09183979B2Publication Date: 2015-11-10
- Inventor: Hye Yeon Cha , Kang Heon Hur , Sung Jin Park , Dong Jin Jeong , Jung Min Park , Hyeog Soo Shin , Sung Yong An , Hwan Soo Lee , Young Do Kweon , Jin Woo Hahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0140409 20111222
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F41/04 ; H01F17/00
Abstract:
The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.
Public/Granted literature
- US20130162382A1 CHIP INDUCTOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-06-27
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