公开(公告)号：US10801121B2

公开(公告)日：2020-10-13

申请号：US15881296

申请日：2018-01-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Yeon Cha ,  Dong Hwan Lee ,  Jung Hyuk Jung ,  Chan Yoon ,  Hye Min Bang ,  Tae Young Kim

IPC: H01F27/28 ,  C25D7/00 ,  C25D5/02 ,  C25D5/10 ,  C25D5/16 ,  H01F17/00 ,  H01F17/04 ,  H01F27/29 ,  H01F41/04

Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.

公开(公告)号：US10586648B2

公开(公告)日：2020-03-10

申请号：US15784633

申请日：2017-10-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jae Lee ,  Youn Soo Seo ,  Jae Ha Kim ,  Hye Yeon Cha

IPC: H01F27/28 ,  H01F41/12 ,  H01F41/04 ,  H01F27/32 ,  H01F27/24 ,  H01F17/00

Abstract: A coil component includes a body portion including a magnetic material, and a coil portion disposed in the body part. The coil portion includes a first coil pattern layer having a planar spiral pattern, an insulating layer formed of an insulating resin embedding at least a portion of the first coil pattern layer, and a second coil pattern layer disposed on the insulating layer and having a planar spiral pattern. The insulating layer includes a core material disposed between the first and second coil pattern layers, and a thickness of a lower region of the insulating layer disposed below the core material is greater than a thickness of an upper region of the insulating layer disposed above the core material.

公开(公告)号：US10529476B2

公开(公告)日：2020-01-07

申请号：US15665263

申请日：2017-07-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Sik Park ,  Sang Jae Lee ,  Youn Soo Seo ,  Yong Sam Lee ,  Hye Yeon Cha ,  Jae Ha Kim

IPC: H01F5/00 ,  H01F5/04 ,  H01F41/04

Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.

公开(公告)号：US09437363B2

公开(公告)日：2016-09-06

申请号：US14321059

申请日：2014-07-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Woon Chul Choi ,  Sung Hyun Kim ,  Hye Yeon Cha

IPC: H01F5/00 ,  H01F41/04 ,  H01F17/00

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/292 ,  H01F41/042

Abstract: An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.

Abstract translation: 电感器可以包括：主体，以及形成在主体的端表面上的第一和第二外部电极。 主体可以包括线圈支撑层，形成在线圈支撑层的至少一个表面上的导电线圈，形成在导电线圈的间隙中并在其上表面上的层叠部分，形成为封闭 形成有层叠部的导电线圈的整个表面，以及覆盖形成有绝缘涂层部的导电线圈的整个表面的上下覆盖层。

公开(公告)号：US09269486B2

公开(公告)日：2016-02-23

申请号：US13843740

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Soo Park ,  Hwan Soo Lee ,  Hye Yeon Cha

IPC: H01F5/00 ,  H01F27/24 ,  H01F27/02 ,  H01F27/255 ,  H01F17/00 ,  H01F41/04 ,  H01F17/04

CPC classification number: H01F27/255 ,  H01F17/0013 ,  H01F41/046 ,  H01F2017/048 ,  Y10T29/4902

Abstract: There is provided a power inductor, including a magnetic body including a substrate having coils formed thereon, a first metal-polymer complex layer formed on upper and lower surfaces of the substrate, and a second metal-polymer complex layer formed on upper and lower surfaces of the first metal-polymer complex layer and including a higher content of a polymer than that included in the first metal-polymer layer.

Abstract translation: 提供了一种功率电感器，包括：磁体，包括其上形成有线圈的基板;形成在基板的上表面和下表面上的第一金属 - 聚合物复合层;以及形成在上表面和下表面上的第二金属 - 聚合物复合层 的第一金属 - 聚合物复合层并且包含比包含在第一金属 - 聚合物层中的聚合物更高的含量。

公开(公告)号：US20130162382A1

公开(公告)日：2013-06-27

申请号：US13725478

申请日：2012-12-21

Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD

Inventor： Hye Yeon Cha ,  Kang Heon Hur ,  Sung Jin Park ,  Dong Jin Jeong ,  Jung Min Park ,  Hyeog Soo Shin ,  Sung Yong An ,  Hwan Soo Lee ,  Young Do KWEON ,  Jin Woo Hahn

IPC: H01F27/29 ,  H01F41/04

CPC classification number: H01F27/29 ,  H01F5/00 ,  H01F17/0033 ,  H01F27/292 ,  H01F41/041 ,  H01F41/046 ,  Y10T29/4902

Abstract: The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.

Abstract translation: 芯片电感器技术领域本发明涉及一种芯片电感器，包括：金属 - 聚合物复合体，其中金属颗粒和聚合物混合; 设置在金属 - 聚合物复合材料内部以形成线圈的布线图案; 设置在所述金属 - 聚合物复合材料的外周表面的一部分中的外部电极; 以及设置在金属 - 聚合物复合物和布线图案之间以及金属 - 聚合物复合材料和外部电极之间的绝缘部分及其制造方法。

公开(公告)号：US10102969B2

公开(公告)日：2018-10-16

申请号：US14942768

申请日：2015-11-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Soo Park ,  Jong Sik Yoon ,  Kyung Han Ahn ,  Dong Hwan Lee ,  Hye Yeon Cha ,  Jong Ho Lee

IPC: H01F41/04 ,  H01F17/00 ,  H01F17/04

Abstract: A method of manufacturing an electronic component having high inductance (L) and an excellent quality (Q) factor and direct current (DC)-bias characteristics includes forming a magnetic body in which internal coil parts are embedded, and forming a cover part including a magnetic metal plate on at least one of upper and lower portions of the magnetic body.

公开(公告)号：US20150155093A1

公开(公告)日：2015-06-04

申请号：US14475000

申请日：2014-09-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Hee KIM ,  Tae Young Kim ,  Myoung Soon Park ,  Sung Hyun Kim ,  Hye Yeon Cha

IPC: H01F27/32 ,  H01F41/00 ,  H01F41/04 ,  H01F41/02 ,  H01F27/28 ,  H01F27/29

CPC classification number: H01F27/327 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F41/042 ,  H01F41/046 ,  H01F41/127 ,  H01F2017/048

Abstract: The present application provides a chip electronic component and a manufacturing method thereof. More particularly, there is provided a chip electronic component including a thin insulating film having a reduced width and extended up to a lower portion of a coil pattern without exposing the coil pattern such that the coil pattern has no direct contact with a magnetic material, thereby preventing a poor waveform at high frequency and increasing inductance.

Abstract translation: 本申请提供了一种芯片电子部件及其制造方法。 更具体地，提供了一种芯片电子部件，其包括具有减小的宽度的薄绝缘膜，并且延伸到线圈图案的下部，而不暴露线圈图案，使得线圈图案不与磁性材料直接接触，由此 防止高频波形较差，增加电感。

公开(公告)号：US20140151089A1

公开(公告)日：2014-06-05

申请号：US13826771

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Woon Chul CHOI ,  Hwan Soo Lee ,  Hye Yeon Cha

IPC: G03F7/34 ,  H05K1/02

CPC classification number: G03F7/34 ,  H05K1/0221 ,  H05K3/28 ,  H05K3/281 ,  H05K3/3452 ,  H05K2203/0537 ,  H05K2203/0594

Abstract: Disclosed herein are a printed circuit board, including: a substrate having a patterned circuit layer on one surface thereof; and a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer, wherein a width of the resist pattern covering an upper portion of the circuit layer is the same as that of the resist pattern covering a lower portion of the circuit layer, and a method for manufacturing the same.

Abstract translation: 本文公开了一种印刷电路板，包括：在其一个表面上具有图案化电路层的基板; 以及抗蚀剂图案，其具有与电路层对应的图案，并且覆盖电路层以闭合电路层，其中覆盖电路层上部的抗蚀剂图案的宽度与抗蚀剂图案覆盖层的宽度相同 电路层的下部及其制造方法。

公开(公告)号：US09945042B2

公开(公告)日：2018-04-17

申请号：US14485402

申请日：2014-09-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Yeon Cha ,  Dong Hwan Lee ,  Jung Hyuk Jung ,  Chan Yoon ,  Hye Min Bang ,  Tae Young Kim

IPC: H01F27/28 ,  H01F5/00 ,  H01F27/24 ,  C25D7/00 ,  H01F17/00 ,  H01F17/04 ,  H01F27/29 ,  H01F41/04 ,  C25D5/02 ,  C25D5/10 ,  C25D5/16

CPC classification number: C25D7/001 ,  C25D5/02 ,  C25D5/10 ,  C25D5/16 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F41/046

Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.