发明授权
US09163144B2 Silicone resin composition, silicone laminated substrate using the same, method for producing the same, and LED device
有权
硅树脂组合物,使用其的硅树脂层压基板,其制造方法和LED装置
- 专利标题: Silicone resin composition, silicone laminated substrate using the same, method for producing the same, and LED device
- 专利标题(中): 硅树脂组合物,使用其的硅树脂层压基板,其制造方法和LED装置
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申请号: US13961391申请日: 2013-08-07
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公开(公告)号: US09163144B2公开(公告)日: 2015-10-20
- 发明人: Saiko Akahane , Shigeo Yamaguchi , Tsutomu Kashiwagi
- 申请人: SHIN-ETSU CHEMICAL CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: SHIN-ETSU CHEMICAL CO., LTD.
- 当前专利权人: SHIN-ETSU CHEMICAL CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2012-237462 20121029
- 主分类号: C08G77/08
- IPC分类号: C08G77/08 ; C08L83/04 ; C03C25/00 ; H01L33/56 ; H01L33/48
摘要:
The invention provides a silicone resin composition for producing a silicone laminated substrate by being impregnated in a glass cloth and cured therein, comprising: (A) an organopolysiloxane with a 3-dimensional network structure composed of an R1SiO1.5 unit and an R2SiO1.5 unit and a T unit represented by an RSiO1.5 unit; (B) an organohydrogenpolysiloxane composed of an R1SiO1.5 unit, an R12SiO unit and an R1aHbSiO(4-a-b)/2 unit; (C) a platinum group metal catalyst; and (D) a filler. There can be a silicone resin composition having a high glass transition temperature, a silicone laminated substrate excellent in properties such as heat resistance and weatherability having low thermal expansion coefficient and suppressed warp and deformation, a method for producing the same and an LED device.
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