Invention Grant
- Patent Title: Resist underlayer composition and process of producing integrated circuit devices using the same
- Patent Title (中): 抗蚀底层组合物和使用其制造集成电路器件的工艺
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Application No.: US13539760Application Date: 2012-07-02
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Publication No.: US09140986B2Publication Date: 2015-09-22
- Inventor: Mi-Young Kim , Sang-Kyun Kim , Hyeon-Mo Cho , Sang-Ran Koh , Hui-Chan Yun , Yong-Jin Chung , Jong-Seob Kim
- Applicant: Mi-Young Kim , Sang-Kyun Kim , Hyeon-Mo Cho , Sang-Ran Koh , Hui-Chan Yun , Yong-Jin Chung , Jong-Seob Kim
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2009-0136179 20091231
- Main IPC: C08G77/08
- IPC: C08G77/08 ; G03F7/075 ; G03F7/11 ; H01L21/02 ; H01L21/033 ; C08L83/04 ; C08G77/16 ; C08G77/18 ; C08L83/06
Abstract:
A resist underlayer composition includes a solvent and an organosilane condensation polymerization product, the organosilane condensation polymerization product including about 40 to about 80 mol % of a structural unit represented by the following Chemical Formula 1,
Public/Granted literature
- US20120267766A1 RESIST UNDERLAYER COMPOSITION AND PROCESS OF PRODUCING INTEGRATED CIRCUIT DEVICES USING THE SAME Public/Granted day:2012-10-25
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