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US09136323B2 Drain-end drift diminution in semiconductor devices 有权
半导体器件的漏极漂移减少

Drain-end drift diminution in semiconductor devices
摘要:
A method of fabricating a transistor includes forming a field isolation region in a substrate. After forming the field isolation region, dopant is implanted in a first region of a substrate for formation of a drift region. A drain region is formed in a second region of the substrate. The first and second regions laterally overlap to define a conduction path for the transistor. The first region does not extend laterally across the second region.
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