发明授权
- 专利标题: Drain-end drift diminution in semiconductor devices
- 专利标题(中): 半导体器件的漏极漂移减少
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申请号: US14486104申请日: 2014-09-15
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公开(公告)号: US09136323B2公开(公告)日: 2015-09-15
- 发明人: Hongning Yang , Daniel J. Blomberg , Xu Cheng , Xin Lin , Won Gi Min , Zhihong Zhang , Jiang-Kai Zuo
- 申请人: Hongning Yang , Daniel J. Blomberg , Xu Cheng , Xin Lin , Won Gi Min , Zhihong Zhang , Jiang-Kai Zuo
- 申请人地址: US TX Austin
- 专利权人: Freescale Semiconductor, Inc.
- 当前专利权人: Freescale Semiconductor, Inc.
- 当前专利权人地址: US TX Austin
- 代理机构: Lempia Summerfield Katz LLC
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L29/08 ; H01L29/10
摘要:
A method of fabricating a transistor includes forming a field isolation region in a substrate. After forming the field isolation region, dopant is implanted in a first region of a substrate for formation of a drift region. A drain region is formed in a second region of the substrate. The first and second regions laterally overlap to define a conduction path for the transistor. The first region does not extend laterally across the second region.
公开/授权文献
- US20150004768A1 DRAIN-END DRIFT DIMINUTION IN SEMICONDUCTOR DEVICES 公开/授权日:2015-01-01
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