发明授权
- 专利标题： Bonding package components through plating
- 专利标题（中）： 通过电镀将封装组件接合
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申请号： US13527422申请日： 2012-06-19
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公开(公告)号： US09117772B2公开(公告)日： 2015-08-25
- 发明人: Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
- 申请人： Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/31 ; H01L25/10 ; H01L25/00 ; H01L25/065 ; H01L21/56 ; H01L23/498 ; H01L23/00
摘要：
A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
公开/授权文献
- US20130334692A1 Bonding Package components Through Plating 公开/授权日：2013-12-19
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