Invention Grant
- Patent Title: Sacrificial wafer probe pads through seal ring for electrical connection to circuit inside an integrated circuit
- Patent Title (中): 牺牲晶片探针垫通过密封环,用于电连接到集成电路内的电路
-
Application No.: US13167152Application Date: 2011-06-23
-
Publication No.: US09048201B2Publication Date: 2015-06-02
- Inventor: Frank Hui , Neal Kistler , Don Bautista
- Applicant: Frank Hui , Neal Kistler , Don Bautista
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox PLLC
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L23/58 ; H01L29/00 ; H01L21/44 ; H01L21/66

Abstract:
The disclosure is directed to a semiconductor wafer, integrated circuit product, and method of making same, having multiple non-singulated chips separated by scribe lines, comprising a plurality of seal rings, each seal ring surrounding a corresponding chip and disposed between the corresponding chip and adjacent scribe lines. Well resistors are disposed below the seal rings and probe pads disposed in the scribe lines. In particular, at least one of the probe pads is coupled by at least one of the well resistors to at least one of the chips.
Public/Granted literature
Information query
IPC分类: