Invention Grant
- Patent Title: Print processing for patterned conductor, semiconductor and dielectric materials
- Patent Title (中): 图案导体,半导体和电介质材料的印刷处理
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Application No.: US13975231Application Date: 2013-08-23
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Publication No.: US09045653B2Publication Date: 2015-06-02
- Inventor: Erik Scher , Steven Molesa , Joerg Rockenberger , Arvind Kamath , Ikuo Mori , Wenzhuo Guo , Dmitry Karshtedt , Vladimir K. Dioumaev
- Applicant: Thin Film Electronics ASA
- Applicant Address: NO Oslo
- Assignee: Thin Film Electronics ASA
- Current Assignee: Thin Film Electronics ASA
- Current Assignee Address: NO Oslo
- Agency: Central California IP Group, P.C.
- Agent Andrew D. Fortney
- Main IPC: C09D11/101
- IPC: C09D11/101 ; C09D5/24 ; C09D11/322 ; C09D11/36 ; C09D11/54 ; H01L21/02 ; H01L21/28 ; H01L29/66 ; H01L29/786 ; H01B3/02 ; H01L27/12

Abstract:
Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.
Public/Granted literature
- US20130344301A1 PRINT PROCESSING FOR PATTERNED CONDUCTOR, SEMICONDUCTOR AND DIELECTRIC MATERIALS Public/Granted day:2013-12-26
Information query
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