The main part of the melt produced during laser welding of two housing parts along a circumferential edge is made to flow towards the printed circuit board by a predefined geometry, thus fixing the board in a form-fitting manner. The basic geometry is modified to prevent the melt from distributing in both directions in an uncontrolled manner and make it flow towards the inside of the housing in a targeted manner. The printed circuit board can thus be fixed and the housing sealed in a single operation. Less space is required on the printed circuit board since the support surfaces only affect the peripheral zone of the printed circuit board. The peripheral zone is a barrier zone since the individual printed circuit board is cut out of a panel. Due to the larger contact surface, prestress losses caused by creep of the plastic have no adverse effect.