发明授权
- 专利标题: Adhesion promoting composition for metal leadframes
- 专利标题(中): 金属引线框架的粘合促进组合物
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申请号: US13954328申请日: 2013-07-30
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公开(公告)号: US09030008B2公开(公告)日: 2015-05-12
- 发明人: Nilesh Kapadia
- 申请人: MacDermid Acumen, Inc.
- 代理机构: Carmody Torrance Sandak & Hennessey LLP
- 主分类号: C09D5/00
- IPC分类号: C09D5/00 ; C09J5/02 ; C09K13/06 ; H01L23/31 ; H01L23/495 ; C23F1/18
摘要:
A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.
公开/授权文献
- US20130312635A1 Adhesion Promoting Composition for Metal Leadframes 公开/授权日:2013-11-28
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