发明授权
- 专利标题: Semiconductor device and manufacturing method thereof
- 专利标题(中): 半导体装置及其制造方法
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申请号: US13235171申请日: 2011-09-16
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公开(公告)号: US09029931B2公开(公告)日: 2015-05-12
- 发明人: Yoshiyuki Kawashima , Koichi Toba
- 申请人: Yoshiyuki Kawashima , Koichi Toba
- 申请人地址: JP Kawasaki-shi
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Kawasaki-shi
- 代理机构: Miles & Stockbridge P.C.
- 优先权: JP2010-212036 20100922
- 主分类号: H01L29/788
- IPC分类号: H01L29/788 ; H01L29/66 ; H01L27/115 ; H01L29/792 ; H01L29/423
摘要:
An improvement is achieved in the performance of semiconductor device including a nonvolatile memory. In a split-gate nonvolatile memory, between a memory gate electrode and a p-type well and between a control gate electrode and the memory gate electrode, an insulating film is formed. Of the insulating film, the portion between the lower surface of the memory gate electrode and the upper surface of a semiconductor substrate has silicon oxide films, and a silicon nitride film interposed between the silicon oxide films. Of the insulating film, the portion between a side surface of the control gate electrode and a side surface of the memory gate electrode is formed of a silicon oxide film, and does not have the silicon nitride film.
公开/授权文献
- US20120068243A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2012-03-22
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