发明授权
US08963342B1 Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types
有权
用于为多种封装类型配置集成电路的结构，架构，系统，方法，算法和软件
- 专利标题： Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types
- 专利标题（中）： 用于为多种封装类型配置集成电路的结构，架构，系统，方法，算法和软件
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申请号： US13905896申请日： 2013-05-30
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公开(公告)号： US08963342B1公开(公告)日： 2015-02-24
- 发明人: Tyson Leistiko , Huahung Kao
- 申请人： Marvell International Ltd.
- 申请人地址： BM Hamilton
- 专利权人： Marvell International Ltd.
- 当前专利权人： Marvell International Ltd.
- 当前专利权人地址： BM Hamilton
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L21/44
摘要：
Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad, a plurality of bond pads configured for independent electrical connection to the bump pad, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the bump pad. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. The method of selecting generally comprises the uppermost metal layer-forming step, and forming either (i) a wire bond to at least one of the bond pads, or (ii) a bumping metal configured to electrically connect at least one of the bond pads to the bump pad.
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IPC分类:
