发明授权
US08962405B2 Method of manufacturing semiconductor device by mounting and positioning a semiconductor die using detection marks
有权
通过使用检测标记安装和定位半导体管芯来制造半导体器件的方法
- 专利标题： Method of manufacturing semiconductor device by mounting and positioning a semiconductor die using detection marks
- 专利标题（中）： 通过使用检测标记安装和定位半导体管芯来制造半导体器件的方法
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申请号： US13798589申请日： 2013-03-13
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公开(公告)号： US08962405B2公开(公告)日： 2015-02-24
- 发明人: Tsunehiro Nakajima , Haruo Nakazawa
- 申请人： Fuji Electric Co., Ltd.
- 申请人地址： JP
- 专利权人： Fuji Electric Co., Ltd.
- 当前专利权人： Fuji Electric Co., Ltd.
- 当前专利权人地址： JP
- 代理机构： Rossi, Kimms & McDowell LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/84 ; H01L21/66 ; G03F9/00 ; H01L29/06 ; H01L29/66 ; H01L29/739 ; H01L21/683 ; H01L23/544 ; H01L21/266
摘要：
In some aspects of the invention, a circuit pattern of a front surface structure is formed in a front surface of a semiconductor wafer and an alignment mark is formed on the front surface of a semiconductor wafer. A transparent supporting substrate is attached to the front surface of the semiconductor wafer by a transparent adhesive. Then, a resist is applied onto a rear surface of the semiconductor wafer. Then, the semiconductor wafer is mounted on a stage of an exposure apparatus, with the supporting substrate down. Then, the alignment mark formed on the front surface of the semiconductor wafer is recognized by a camera, and the positions of the semiconductor wafer and a photomask are aligned with each other. Then, the resist is patterned. Then, a circuit pattern is formed in the rear surface of the semiconductor wafer.
公开/授权文献
- US20130196457A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 公开/授权日：2013-08-01
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