Invention Grant
- Patent Title: High capacity select switches for three-dimensional structures
- Patent Title (中): 用于三维结构的高容量选择开关
-
Application No.: US13925662Application Date: 2013-06-24
-
Publication No.: US08933516B1Publication Date: 2015-01-13
- Inventor: Ming-Che Wu , Wei-Te Wu , Yung-Tin Chen
- Applicant: SanDisk 3D LLC
- Applicant Address: US CA Milpitas
- Assignee: SanDisk 3D LLC
- Current Assignee: SanDisk 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Davis Wright Tremaine LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L29/788 ; H01L27/24 ; H01L45/00

Abstract:
A three-dimensional nonvolatile memory array includes a select layer that selectively connects vertical bit lines to horizontal bit lines. Individual select switches of the select layer include two separately controllable transistors that are connected in series between a horizontal bit line and a vertical bit line. Each transistor in a select switch is connected to a different control circuit by a different select line.
Public/Granted literature
- US20140374688A1 High Capacity Select Switches for Three-Dimensional Structures Public/Granted day:2014-12-25
Information query
IPC分类: