发明授权
- 专利标题： Printed wiring board and method for manufacturing printed wiring board
- 专利标题（中）： 印刷电路板及制造印刷线路板的方法
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申请号： US13307499申请日： 2011-11-30
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公开(公告)号： US08901431B2公开(公告)日： 2014-12-02
- 发明人: Hiroyuki Nishioka , Ryojiro Tominaga , Tatsuya Imai
- 申请人： Hiroyuki Nishioka , Ryojiro Tominaga , Tatsuya Imai
- 申请人地址： JP Ogaki-shi
- 专利权人： Ibiden Co., Ltd.
- 当前专利权人： Ibiden Co., Ltd.
- 当前专利权人地址： JP Ogaki-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K3/40 ; H05K3/34
摘要：
A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion.
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