发明授权
- 专利标题： Electronic assembly with copper pillar attach substrate
- 专利标题（中）： 电子组装与铜柱连接基板
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申请号： US13798678申请日： 2013-03-13
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公开(公告)号： US08896118B2公开(公告)日： 2014-11-25
- 发明人: Nima Shahidi
- 申请人： Texas Instruments Incorporated
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Steven A. Shaw; Frederick J. Telecky, Jr.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44 ; H01L23/498 ; H01L21/48
摘要：
An electronic assembly includes a copper pillar attach substrate that has a dielectric layer and a solder resist layer overlying the dielectric layer. The solder resist layer has a plurality of solder resist openings. A plurality of parallel traces are formed on the dielectric layer. Each trace has a first end portion, a second end portion and an intermediate portion. The first and second end portions of each trace are covered by the solder resist layer and the intermediate portions are positioned in the solder resist openings. Each of the intermediate portions has at least one conductive coating layer on it and has a height measured from the dielectric layer to the top of the topmost conductive coating layer that is at least as great as the solder resist layer thickness.
公开/授权文献
- US20140264829A1 ELECTRONIC ASSEMBLY WITH COPPER PILLAR ATTACH SUBSTRATE 公开/授权日：2014-09-18
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IPC分类:
