发明授权
- 专利标题： Interposers for semiconductor devices and methods of manufacture thereof
- 专利标题（中）： 半导体器件用插入件及其制造方法
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申请号： US13292792申请日： 2011-11-09
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公开(公告)号： US08896089B2公开(公告)日： 2014-11-25
- 发明人: Tzu-Wei Chiu , Tzu-Yu Wang , Wei-Cheng Wu , Chun-Yi Liu , Hsien-Pin Hu , Shang-Yun Hou
- 申请人： Tzu-Wei Chiu , Tzu-Yu Wang , Wei-Cheng Wu , Chun-Yi Liu , Hsien-Pin Hu , Shang-Yun Hou
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, LLP
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/82 ; H01L23/498 ; H01L23/538 ; H01L23/00 ; H01L23/525 ; H01L23/48 ; H01L23/31
摘要：
Interposers for semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, an interposer includes a substrate, a contact pad disposed on the substrate, and a first through-via in the substrate coupled to the contact pad. A first fuse is coupled to the first through-via. A second through-via in the substrate is coupled to the contact pad, and a second fuse is coupled to the second through-via.
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