发明授权
- 专利标题： Methods and apparatus for package on package structures
- 专利标题（中）： 封装结构封装的方法和装置
-
申请号： US13604333申请日： 2012-09-05
-
公开(公告)号： US08889486B2公开(公告)日： 2014-11-18
- 发明人: Meng-Tse Chen , Yi-Da Tsai , Xi-Hong Chen , Tao-Hua Lee , Wei-Yu Chen , Ming-Da Cheng , Chung-Shi Liu
- 申请人： Meng-Tse Chen , Yi-Da Tsai , Xi-Hong Chen , Tao-Hua Lee , Wei-Yu Chen , Ming-Da Cheng , Chung-Shi Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater and Matsil, L.L.P.
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/48 ; H01L21/44
摘要：
A package-on-package (“PoP”) structure and a method of forming are provided. The PoP structure may be formed by forming a first set of electrical connections on a first substrate. A first material may be applied to the first set of electrical connections. A second substrate may be provided having a second set of electrical connections formed thereon. The first set of electrical connections of the first substrate having the epoxy flux applied may be contacted to the second electrical connections of the second substrate. A reflow process may be performed to electrically connect the first substrate to the second substrate. The epoxy flux applied to the first electrical connections of the first substrate may prohibit electrical bridges or shorts from forming during the reflow process.
公开/授权文献
- US20140061932A1 Methods and Apparatus for Package on Package Structures 公开/授权日：2014-03-06
信息查询
IPC分类:
