发明授权
- 专利标题: Multilayered ceramic capacitor and mounting structure of circuit board having multilayered ceramic capacitor mounted thereon
- 专利标题(中): 多层陶瓷电容器和安装有多层陶瓷电容器的电路板的安装结构
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申请号: US13770962申请日: 2013-02-19
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公开(公告)号: US08879235B2公开(公告)日: 2014-11-04
- 发明人: Young Ghyu Ahn , Heung Kil Park , Doo Young Kim , Sang Soo Park , Min Cheol Park
- 申请人: Samsung Electro-Mechanics, Co., Ltd.
- 申请人地址: KR Suwon, Gyunggi-Do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon, Gyunggi-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2012-0136771 20121129
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/005 ; H01G4/06 ; H01G4/12 ; H05K1/16
摘要:
There is provided a multilayered ceramic capacitor, including a ceramic body, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body while having the dielectric layer therebetween, to form capacitance; upper and lower cover layers formed above and below the active layer; first and second external electrodes covering both end surfaces of the ceramic body; a plurality of first and second dummy electrodes extended from the first and second external electrodes; and a plurality of piezoelectric members connecting the first internal electrode and the first dummy electrode or the second internal electrode and the second dummy electrode, inside the active layer, the piezoelectric members having a higher dielectric constant than the dielectric layer.
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