This disclosure provides systems, methods and apparatus for glass-encapsulated microphones. In one aspect, a glass-encapsulated microphone may include a glass substrate, an electromechanical microphone device, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may define an aperture for the electromechanical microphone device at an edge of the glass-encapsulated microphone. In some configurations, the cover glass may define a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical microphone device.