Invention Grant
- Patent Title: Magnetic integration double-ended converter
- Patent Title (中): 磁性积分双端转换器
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Application No.: US13493700Application Date: 2012-06-11
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Publication No.: US08822276B2Publication Date: 2014-09-02
- Inventor: Leif Bergstedt
- Applicant: Leif Bergstedt
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Brinks Gilson & Lione
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/66 ; H01L23/482 ; H01L23/538 ; H01L23/00
Abstract:
The present invention relates to a method of bonding a chip to an external electric circuit. The conductors of the external electric circuit for connection to the chip are formed with physical extensions and the chip is directly bonded to these extensions. The invention also relates to an electric device comprising at least one chip and an external electric circuit. The chip is directly bonded to physical extensions of conductors of the external electric circuit.
Public/Granted literature
- US20120241959A1 MAGNETIC INTEGRATION DOUBLE-ENDED CONVERTER Public/Granted day:2012-09-27
Information query
IPC分类:
