发明授权
- 专利标题： Electrical interconnections of semiconductor devices and methods for fabricating the same
- 专利标题（中）： 半导体器件的电气互连及其制造方法
-
申请号： US13826694申请日： 2013-03-14
-
公开(公告)号： US08816499B2公开(公告)日： 2014-08-26
- 发明人: Ju-il Choi , Jeong-Woo Park , Jeonggi Jin , Yeun-Sang Park
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR
- 代理机构： Myers Bigel Sibley & Sajovec, PA
- 优先权： KR10-2012-0055443 20120524
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L23/00 ; H01L23/31
摘要：
Provided are electrical interconnections and methods for fabricating the same. The electrical interconnection may include a substrate including a bonding pad, a solder ball electrically connected to the bonding pad, a solder supporter on the bonding pad, a portion of the solder ball filling the solder supporter, and a metal layer between the bonding pad and the solder supporter, the metal layer having an ionization tendency lower than the bonding pad.
公开/授权文献
信息查询
IPC分类:
