发明授权
- 专利标题： Removing a sheet from the surface of a melt using elasticity and buoyancy
- 专利标题（中）： 使用弹性和浮力从熔体表面去除片材
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申请号： US13039808申请日： 2011-03-03
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公开(公告)号： US08764901B2公开(公告)日： 2014-07-01
- 发明人: Peter L. Kellerman , Dawei Sun , Brian Helenbrook , David S. Harvey
- 申请人： Peter L. Kellerman , Dawei Sun , Brian Helenbrook , David S. Harvey
- 申请人地址： US MA Gloucester
- 专利权人： Varian Semiconductor Equipment Associates, Inc.
- 当前专利权人： Varian Semiconductor Equipment Associates, Inc.
- 当前专利权人地址： US MA Gloucester
- 主分类号： C30B15/06
- IPC分类号： C30B15/06 ; C30B15/00 ; C30B15/20 ; C30B15/22
摘要：
Embodiments related to sheet production are disclosed. A melt of a material is cooled to form a sheet of the material on the melt. The sheet is formed in a first region at a first sheet height. The sheet is translated to a second region such that it has a second sheet height higher than the first sheet height. The sheet is then separated from the melt. A seed wafer may be used to form the sheet.
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