发明授权
- 专利标题： Integrated circuit packaging system with pad connection and method of manufacture thereof
- 专利标题（中）： 具有垫连接的集成电路封装系统及其制造方法
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申请号： US13426442申请日： 2012-03-21
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公开(公告)号： US08633063B2公开(公告)日： 2014-01-21
- 发明人: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- 申请人： Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side; forming a central lead adjacent to the peripheral lead; forming a first top distribution layer on the peripheral lead top side; connecting an integrated circuit to the first top distribution layer; applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge; and attaching a heatsink to the central lead under the integrated circuit.
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