发明授权
US08609262B2 Structure and method to fabricate high performance MTJ devices for spin-transfer torque (STT)-RAM application
有权
用于制造自旋转矩(STT)-RAM应用的高性能MTJ装置的结构和方法
- 专利标题: Structure and method to fabricate high performance MTJ devices for spin-transfer torque (STT)-RAM application
- 专利标题(中): 用于制造自旋转矩(STT)-RAM应用的高性能MTJ装置的结构和方法
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申请号: US12460412申请日: 2009-07-17
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公开(公告)号: US08609262B2公开(公告)日: 2013-12-17
- 发明人: Cheng T. Horng , Ru-Ying Tong , Guangli Liu , Robert Beach , Witold Kula , Tai Min
- 申请人: Cheng T. Horng , Ru-Ying Tong , Guangli Liu , Robert Beach , Witold Kula , Tai Min
- 申请人地址: US CA Milpitas
- 专利权人: MagIC Technologies, Inc.
- 当前专利权人: MagIC Technologies, Inc.
- 当前专利权人地址: US CA Milpitas
- 代理机构: Saile Ackerman LLC
- 代理商 Stephen B. Ackerman
- 主分类号: G11B5/706
- IPC分类号: G11B5/706 ; H01L43/08 ; H01L29/82 ; G01R33/09 ; G11C11/16
摘要:
A STT-RAM MTJ is disclosed with a MgO tunnel barrier formed by natural oxidation and containing an oxygen surfactant layer to form a more uniform MgO layer and lower breakdown distribution percent. A CoFeB/NCC/CoFeB composite free layer with a middle nanocurrent channel layer minimizes Jc0 while enabling thermal stability, write voltage, read voltage, and Hc values that satisfy 64 Mb design requirements. The NCC layer has RM grains in an insulator matrix where R is Co, Fe, or Ni, and M is a metal such as Si or Al. NCC thickness is maintained around the minimum RM grain size to avoid RM granules not having sufficient diameter to bridge the distance between upper and lower CoFeB layers. A second NCC layer and third CoFeB layer may be included in the free layer or a second NCC layer may be inserted below the Ru capping layer.
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