发明授权
- 专利标题: ESD field-effect transistor and integrated diffusion resistor
- 专利标题(中): ESD场效应晶体管和集成扩散电阻
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申请号: US13188094申请日: 2011-07-21
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公开(公告)号: US08513738B2公开(公告)日: 2013-08-20
- 发明人: John B. Campi, Jr. , Shunhua T. Chang , Kiran V. Chatty , Robert J. Gauthier, Jr. , Junjun Li , Rahul Mishra , Mujahid Muhammad
- 申请人: John B. Campi, Jr. , Shunhua T. Chang , Kiran V. Chatty , Robert J. Gauthier, Jr. , Junjun Li , Rahul Mishra , Mujahid Muhammad
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Wood, Herron & Evans LLP
- 代理商 Anthony J. Canale
- 主分类号: H01L23/60
- IPC分类号: H01L23/60
摘要:
An electrostatic discharge protection device, methods of fabricating an electrostatic discharge protection device, and design structures for an electrostatic discharge protection device. A drain of a first field-effect transistor and a diffusion resistor of higher electrical resistance may be formed as different portions of a doped region. The diffusion resistor, which is directly coupled with the drain of the first field-effect transistor, may be defined using an isolation region of dielectric material disposed in the doped region and selective silicide formation. The electrostatic discharge protection device may also include a second field-effect transistor having a drain as a portion the doped region that is directly coupled with the diffusion resistor and indirectly coupled by the diffusion resistor with the drain of the first field-effect transistor.
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