Invention Grant
- Patent Title: Memory having buried digit lines and methods of making the same
- Patent Title (中): 具有埋置数字线的存储器和制作相同的方法
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Application No.: US12721404Application Date: 2010-03-10
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Publication No.: US08497541B2Publication Date: 2013-07-30
- Inventor: Kunal Parekh , David Hwang , Wen Kuei Huang , Kuo Chen Wang , Ching Kai Lin
- Applicant: Kunal Parekh , David Hwang , Wen Kuei Huang , Kuo Chen Wang , Ching Kai Lin
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Fletcher Yoder
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
A memory array having memory cells and methods of forming the same. The memory array may have a buried digit line formed in a first horizontal planar volume, a word line formed in a second horizontal planar volume above the first horizontal planar volume and storage devices formed on top of the vertical access devices, such as finFETs, in a third horizontal planar volume above the second horizontal planar volume. The memory array may have a 4F2 architecture, wherein each memory cell includes two vertical access devices, each coupled to a single storage device.
Public/Granted literature
- US20110220980A1 MEMORY HAVING BURIED DIGIT LINES AND METHODS OF MAKING THE SAME Public/Granted day:2011-09-15
Information query
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